Invention Grant
- Patent Title: Compression-molded parts having an embedded conductive layer and method for making same
- Patent Title (中): 具有嵌入导电层的压缩成型部件及其制造方法
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Application No.: US13552781Application Date: 2012-07-19
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Publication No.: US08625250B2Publication Date: 2014-01-07
- Inventor: Anthony P. Bergerson , Jason L. Hoyle
- Applicant: Anthony P. Bergerson , Jason L. Hoyle
- Applicant Address: US RI Providence
- Assignee: Textron Innovations Inc.
- Current Assignee: Textron Innovations Inc.
- Current Assignee Address: US RI Providence
- Agent James E. Walton; Damon R. Hickman
- Main IPC: H05F3/00
- IPC: H05F3/00

Abstract:
A compression-molded part has a conductive layer embedded in the part during molding of the part. The conductive layer is generally adjacent an outer surface of the part and is preferably formed from a mesh, a foil, a pulled screen, or multiple layers of conductive elements. The part is preferably optimized for use on the exterior of an aircraft for lightning-strike or EMI protection or for use as an antenna. Methods for forming the panels of the invention include placing the conductive layer against a mold surface of a compression mold, then forming the compression-molded part with the conductive layer embedded in the part.
Public/Granted literature
- US20130328226A1 COMPRESSION-MOLDED PARTS HAVING AN EMBEDDED CONDUCTIVE LAYER AND METHOD FOR MAKING SAME Public/Granted day:2013-12-12
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