Invention Grant
- Patent Title: Serial advanced technology attachment DIMM
- Patent Title (中): 串行高级技术附件DIMM
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Application No.: US13172603Application Date: 2011-06-29
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Publication No.: US08625269B2Publication Date: 2014-01-07
- Inventor: Yung-Chieh Chen , Shou-Kuo Hsu
- Applicant: Yung-Chieh Chen , Shou-Kuo Hsu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW100120781 20110614
- Main IPC: G06F1/16
- IPC: G06F1/16
Abstract:
A serial advanced technology attachment (SATA) DIMM includes a board body. A control chip is arranged on the board body. An extending board extends from an end of the board body. A first edge connector is set on the extending board. A second edge connector is set on a bottom side of the board body. The first edge connector includes a number of signal pins connected to the control chip, and a number of ground pins.
Public/Granted literature
- US20120320518A1 SERIAL ADVANCED TECHNOLOGY ATTACHMENT DIMM Public/Granted day:2012-12-20
Information query
