Invention Grant
- Patent Title: Electronic device with heat dissipation apparatus
- Patent Title (中): 带散热装置的电子设备
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Application No.: US13338253Application Date: 2011-12-28
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Publication No.: US08625275B2Publication Date: 2014-01-07
- Inventor: Tai-Wei Lin
- Applicant: Tai-Wei Lin
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW100148146A 20111222
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20
Abstract:
A heat dissipation apparatus includes a shaped and resilient connecting plate, and a first heat-dissipating plate and a second heat-dissipating plate clamping down on a storage device to dissipate heat.
Public/Granted literature
- US20130163176A1 ELECTRONIC DEVICE WITH HEAT DISSIPATION APPARATUS Public/Granted day:2013-06-27
Information query
