Invention Grant
US08625280B2 Cooling memory modules using cold plate blades coupled to the memory modules via clips
有权
使用通过夹子耦合到存储器模块的冷板叶片来冷却存储器模块
- Patent Title: Cooling memory modules using cold plate blades coupled to the memory modules via clips
- Patent Title (中): 使用通过夹子耦合到存储器模块的冷板叶片来冷却存储器模块
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Application No.: US13260066Application Date: 2009-10-30
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Publication No.: US08625280B2Publication Date: 2014-01-07
- Inventor: Timothy Rau , Glenn C. Simon
- Applicant: Timothy Rau , Glenn C. Simon
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2009/062748 WO 20091030
- International Announcement: WO2011/053310 WO 20110505
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34
Abstract:
A cold plate has blades arranged to be interleaved with memory modules, with clips coupling blades to memory modules. A liquid cooling loop is thermally coupled to the blades of the cold plate.
Public/Granted literature
- US20120026670A1 COOLING MEMORY MODULES USING COLD PLATE BLADES COUPLED TO THE MEMORY MODULES VIA CLIPS Public/Granted day:2012-02-02
Information query
