Invention Grant
- Patent Title: Circuit board with even current distribution
- Patent Title (中): 电路板均匀分布
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Application No.: US13220709Application Date: 2011-08-30
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Publication No.: US08625299B2Publication Date: 2014-01-07
- Inventor: Tsung-Sheng Huang
- Applicant: Tsung-Sheng Huang
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW100211640A 20110624
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14

Abstract:
A circuit board includes an outer conductive layer, a number of inner conductive layers, at least one group of vias defined through the outer conductive layer and the inner conductive layers and electrically connected each conductive layers, at least one power supply element, and at least one electronic element. The at least one group of vias surrounds the at least one power supply element. When the least one power supply element outputs current to the at least one electronic element, a first portion of the output current flows to the inner conductive layers through the group of vias surrounding the at least one power supply element to be input to the at least one electronic element, and a second portion of the output current flows into the at least one electronic element through the outer conductive layer.
Public/Granted literature
- US20120325530A1 CIRCUIT BOARD WITH EVEN CURRENT DISTRIBUTION Public/Granted day:2012-12-27
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