Invention Grant
US08625303B2 Serial advanced technology attachment dual in-line memory module assembly
失效
串行高级技术附件双列直插式内存模组装配
- Patent Title: Serial advanced technology attachment dual in-line memory module assembly
- Patent Title (中): 串行高级技术附件双列直插式内存模组装配
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Application No.: US13339409Application Date: 2011-12-29
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Publication No.: US08625303B2Publication Date: 2014-01-07
- Inventor: Xiao-Gang Yin , Guo-Yi Chen
- Applicant: Xiao-Gang Yin , Guo-Yi Chen
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110420537 20111215
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K5/00

Abstract:
A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a first circuit board, an expansion slot, and an expansion card with a second circuit board. A first edge connector is arranged on a bottom edge of the first circuit board and includes first power pins connected to a control chip and first storage chips, and first ground pins. A second edge connector is arranged on a top edge of the second circuit board and includes second power pins connected to a power unit, and second ground pins. A third edge connector is arranged on a bottom edge of the second circuit board and includes third power pins connected to the power unit, third ground pins, and signal pins connected to a display unit.
Public/Granted literature
- US20130155637A1 SERIAL ADVANCED TECHNOLOGY ATTACHMENT DUAL IN-LINE MEMORY MODULE ASSEMBLY Public/Granted day:2013-06-20
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