Invention Grant
- Patent Title: Memory word line boost using thin dielectric capacitor
- Patent Title (中): 使用薄介质电容的存储字线升压
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Application No.: US13736501Application Date: 2013-01-08
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Publication No.: US08625383B2Publication Date: 2014-01-07
- Inventor: Hung-Chang Yu , Yue-Der Chih
- Applicant: Hung-Chang Yu , Yue-Der Chih
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: G11C8/00
- IPC: G11C8/00

Abstract:
A memory including a boost circuit configured to supply a voltage higher than a supply voltage to a word line. The boost circuit includes a first capacitor having a first capacitor dielectric thickness. The boost circuit further includes a transmission gate coupled to the word line and the first capacitor, the transmission gate having a gate-dielectric thickness that is greater than the first capacitor dielectric thickness.
Public/Granted literature
- US20130121088A1 MEMORY WORD LINE BOOST USING THIN DIELECTRIC CAPACITOR Public/Granted day:2013-05-16
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