Invention Grant
- Patent Title: Embedded Access Point
- Patent Title (中): 嵌入式接入点
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Application No.: US12752947Application Date: 2010-04-01
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Publication No.: US08625488B1Publication Date: 2014-01-07
- Inventor: Shantanu Arun Gogate , Rajesh Shreeram Bhagwat , Sandesh Goel , Kaustubh Shrikrishna Patwardhan , Bart A. Giordano
- Applicant: Shantanu Arun Gogate , Rajesh Shreeram Bhagwat , Sandesh Goel , Kaustubh Shrikrishna Patwardhan , Bart A. Giordano
- Applicant Address: BM Hamilton
- Assignee: Marvell International Ltd.
- Current Assignee: Marvell International Ltd.
- Current Assignee Address: BM Hamilton
- Main IPC: H04Q1/00
- IPC: H04Q1/00

Abstract:
A wireless access point includes a wireless communication module to establish a wireless connection with a first station; a first processing unit to perform a network function in a first basic service set (BSS) including the wireless access point and the first station; and a first connector to removably mate with a second connector, where a device separate from the wireless access point is (i) coupled to the second connector and (ii) has a second processing unit and a power source, where the first processing unit of the wireless access point is directly powered by the power source via the first connector and the second connector.
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