Invention Grant
- Patent Title: Removable sensor modules
- Patent Title (中): 可移动传感器模块
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Application No.: US13287920Application Date: 2011-11-02
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Publication No.: US08625748B2Publication Date: 2014-01-07
- Inventor: Bryan Joseph Kioski , David Knaggs , Paul A. Knight
- Applicant: Bryan Joseph Kioski , David Knaggs , Paul A. Knight
- Applicant Address: US WA Liberty Lake
- Assignee: Telect, Inc.
- Current Assignee: Telect, Inc.
- Current Assignee Address: US WA Liberty Lake
- Agency: Lee & Hayes, PLLC
- Main IPC: H04M1/24
- IPC: H04M1/24 ; H04M3/08 ; H04M3/22
Abstract:
A removable telecommunication sensor module is configured to be removably coupled between a power protection device and a bus bar and/or a backplane. The removable telecommunication sensor module monitors energy usage at a telecommunication equipment circuit level for a piece of telecommunication equipment arranged in a telecommunication network infrastructure.
Public/Granted literature
- US20130108027A1 Removable Sensor Modules Public/Granted day:2013-05-02
Information query
