Invention Grant
- Patent Title: Apparatus and method for mounting an inclined component with respect to a substrate
- Patent Title (中): 相对于基板安装倾斜部件的装置和方法
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Application No.: US12858773Application Date: 2010-08-18
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Publication No.: US08625879B2Publication Date: 2014-01-07
- Inventor: Hiroyuki Motohara
- Applicant: Hiroyuki Motohara
- Applicant Address: JP Tokyo
- Assignee: Olympus Corporation
- Current Assignee: Olympus Corporation
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2009-190275 20090819
- Main IPC: G06K9/00
- IPC: G06K9/00 ; H05K3/30 ; G01B11/02

Abstract:
A mounting apparatus which mounts on a substrate, a component having an inclined surface which intersects with a contact surface of the substrate and the component, at an acute angle, includes a first light source having an optical path orthogonal to the contact surface, and a camera which picks up an image of the component and an image of the substrate, a second light source which irradiates light on the inclined surface, and a moving means which moves at least one of the component and the substrate relatively, in a plane parallel to the surface of contact, and reflected light which is irradiated from the second light source, and reflected by the inclined surface is incident on the image pickup section.
Public/Granted literature
- US20110043622A1 MOUNTING APPARATUS AND MOUNTING METHOD Public/Granted day:2011-02-24
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