Invention Grant
- Patent Title: Cooling provisioning management in a three dimensional package
- Patent Title (中): 冷却配置管理三维包
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Application No.: US12935985Application Date: 2008-04-01
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Publication No.: US08626355B2Publication Date: 2014-01-07
- Inventor: Amip Shah , Chandrakant Patel
- Applicant: Amip Shah , Chandrakant Patel
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L. P.
- Current Assignee: Hewlett-Packard Development Company, L. P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2008/059008 WO 20080401
- International Announcement: WO2009/123621 WO 20091008
- Main IPC: G05D23/00
- IPC: G05D23/00
Abstract:
In a method for managing cooling provisioning in a three-dimensional package containing a plurality of stacked die with a cooling system having at least one active cooling mechanism, at least one of workload on and an environmental condition at or around one of the plurality of stacked die is identified. In addition, at least one of the active cooling mechanism and the one of the plurality of stacked die is controlled based upon at least one of the identified workload and environmental condition.
Public/Granted literature
- US20110029153A1 Cooling Provisioning Management In A Three Dimensional Package Public/Granted day:2011-02-03
Information query
