Invention Grant
US08626480B2 Compact model for device/circuit/chip leakage current (IDDQ) calculation including process induced uplift factors
失效
紧凑型器件/电路/芯片泄漏电流(IDDQ)计算,包括工艺引起的隆起因素
- Patent Title: Compact model for device/circuit/chip leakage current (IDDQ) calculation including process induced uplift factors
- Patent Title (中): 紧凑型器件/电路/芯片泄漏电流(IDDQ)计算,包括工艺引起的隆起因素
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Application No.: US12574440Application Date: 2009-10-06
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Publication No.: US08626480B2Publication Date: 2014-01-07
- Inventor: Paul Chang , Jie Deng , Terrence B. Hook , Sim Y. Loo , Anda C. Mocuta , Jae-Eun Park , Kern Rim , Xiaojun Yu
- Applicant: Paul Chang , Jie Deng , Terrence B. Hook , Sim Y. Loo , Anda C. Mocuta , Jae-Eun Park , Kern Rim , Xiaojun Yu
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Joseph P. Abate, Esq.
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A system, method and computer program product for implementing a quiescent current leakage specific model into semiconductor device design and circuit design flows. The leakage model covers all device geometries with wide temperature and voltage ranges and, without the need for stacking factor calculations nor spread sheet based IDDQ calculations. The leakage model for IDDQ calculation incorporates further parasitic and proximity effects. The leakage model implements leakage calculations at different levels of testing, e.g., from a single device to a full chip design, and are integrated within one single model. The leakage model implements leakage calculations at different levels of testing with the leverage of a single switch setting. The implementation is via a hardware definition language code or object oriented code that can be compiled and operated using a netlist of interest, e.g., for conducting a performance analysis.
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