Invention Grant
- Patent Title: Workload allocation based upon heat re-circulation causes
- Patent Title (中): 基于热循环的工作量分配原因
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Application No.: US11129987Application Date: 2005-05-16
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Publication No.: US08626918B2Publication Date: 2014-01-07
- Inventor: Justin Moore , Parthasarathy Ranganathan , Ratnesh Sharma
- Applicant: Justin Moore , Parthasarathy Ranganathan , Ratnesh Sharma
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G06F15/173
- IPC: G06F15/173 ; G06F9/46
Abstract:
A method of allocating workload among servers in a geographically collocated cluster of compute equipment includes calibrating causes of heat re-circulation in the cluster of compute equipment. In addition, workload is allocated among the servers to address causes of the heat re-circulation to reduce costs associated with cooling the compute equipment.
Public/Granted literature
- US20060259622A1 Workload allocation based upon heat re-circulation causes Public/Granted day:2006-11-16
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