Invention Grant
US08627245B1 Density balancing in multiple patterning lithography using integrated circuit layout fill
有权
使用集成电路布局填充的多重图案化光刻中的密度平衡
- Patent Title: Density balancing in multiple patterning lithography using integrated circuit layout fill
- Patent Title (中): 使用集成电路布局填充的多重图案化光刻中的密度平衡
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Application No.: US13596140Application Date: 2012-08-28
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Publication No.: US08627245B1Publication Date: 2014-01-07
- Inventor: Shayak Banerjee , Lars W. Liebmann , Ian P. Stobert
- Applicant: Shayak Banerjee , Lars W. Liebmann , Ian P. Stobert
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Yuanmin Cai
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
In various embodiments, a method of designing an integrated circuit (IC) layout for a multiple patterning layout fill process includes: providing a pre-characterized mask tile library including a plurality of distinct mask tiles each having a distinct mask density on a plurality of distinct exposures each associated with a patterning process in the multiple patterning process; determining a density of a mask group in a first layout window in the IC layout, the first layout window including an open space unfilled by the mask group; and selecting a set of mask tiles from the plurality of distinct mask tiles to fill a portion of the open space, the selecting based upon the determined density of the mask group in the first layout window and the distinct mask density of the selected set of mask tiles on the plurality of distinct exposures.
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