Invention Grant
- Patent Title: Method for manufacturing injection hole member
- Patent Title (中): 喷孔构件的制造方法
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Application No.: US12929746Application Date: 2011-02-14
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Publication No.: US08631579B2Publication Date: 2014-01-21
- Inventor: Masanori Miyagawa , Tsunehiro Uehara
- Applicant: Masanori Miyagawa , Tsunehiro Uehara
- Applicant Address: JP Kariya JP Suwa
- Assignee: Denso Corporation,Komatsuseiki Kosakusho Co., Ltd.
- Current Assignee: Denso Corporation,Komatsuseiki Kosakusho Co., Ltd.
- Current Assignee Address: JP Kariya JP Suwa
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2002-381501 20021227; JP2002-381687 20021227; JP2002-381753 20021227; JP2003-385684 20031114
- Main IPC: B21D51/16
- IPC: B21D51/16

Abstract:
A lead hole is formed in a base material of an injection hole member with a straight punch, and then, a taper hole is formed in the base material by widening the lead hole with a taper punch. An intersection line between a virtual plane perpendicular to a central axis of the lead hole and an inner peripheral surface of the lead hole is elliptic in shape, whose major axis is directed along an intersection line between a virtual plane, which includes the central axis of the lead hole and a thickness direction axis of the base material, and the virtual plane perpendicular to the central axis of the lead hole. An intersection line between a virtual plane perpendicular to a central axis of the taper punch and an outer peripheral surface of the taper punch is round in shape.
Public/Granted literature
- US20110138628A1 Method for manufacturing injection hole member Public/Granted day:2011-06-16
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