Invention Grant
- Patent Title: Modular flooring assemblies
- Patent Title (中): 模块化地板组件
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Application No.: US13399239Application Date: 2012-02-17
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Publication No.: US08631624B2Publication Date: 2014-01-21
- Inventor: Jonathan McIntosh , Nicole C. Sperling
- Applicant: Jonathan McIntosh , Nicole C. Sperling
- Applicant Address: US NE Omaha
- Assignee: CoMc, LLC
- Current Assignee: CoMc, LLC
- Current Assignee Address: US NE Omaha
- Agency: Edwin A. Sisson, Attorney at Law, LLC
- Main IPC: E04B2/08
- IPC: E04B2/08

Abstract:
A modular flooring assembly including a flooring component adhered to a tray substrate is described. The modular flooring assembly may be interconnected with additional modular flooring assemblies to form a modular floor suitable for most flooring applications. The flooring component may be tile or wood or other materials commonly used in flooring applications. Convention fill-in grout or a snap-in grout may be used with the modular flooring assemblies. One suitable snap-in grout is a right angle grout member.
Public/Granted literature
- US20120144770A1 MODULAR FLOORING ASSEMBLIES Public/Granted day:2012-06-14
Information query
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