Invention Grant
- Patent Title: Noise suppressor for semiconductor packages
- Patent Title (中): 半导体封装的抑制器
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Application No.: US12840861Application Date: 2010-07-21
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Publication No.: US08631706B2Publication Date: 2014-01-21
- Inventor: Nickolaus J Gruendler , Paul M Harvey , Tae Hong Kim , Sang Y Lee , Michael J Shapiro
- Applicant: Nickolaus J Gruendler , Paul M Harvey , Tae Hong Kim , Sang Y Lee , Michael J Shapiro
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Joscelyn Cockburn
- Main IPC: G01L9/12
- IPC: G01L9/12 ; H01R9/00 ; H05K7/20
Abstract:
One or more decoupling capacitors are coupled to a low inductance mount that is connected to the bottom layer of a printed circuit board (PCB) on which a semiconductor module is mounted. The low inductance mount includes a magnetic planar structure with vias that are coupled to the one or more decoupling capacitors and to like vias positioned on the PCB.
Public/Granted literature
- US20120020042A1 NOISE SUPPRESSOR FOR SEMICONDUCTOR PACKAGES Public/Granted day:2012-01-26
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