Invention Grant
- Patent Title: Wireless IC device
- Patent Title (中): 无线IC设备
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Application No.: US12510347Application Date: 2009-07-28
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Publication No.: US08632014B2Publication Date: 2014-01-21
- Inventor: Noboru Kato , Yuya Dokai , Nobuo Ikemoto
- Applicant: Noboru Kato , Yuya Dokai , Nobuo Ikemoto
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2007-120249 20070427
- Main IPC: G06K19/06
- IPC: G06K19/06
Abstract:
A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.
Public/Granted literature
- US20090277967A1 WIRELESS IC DEVICE Public/Granted day:2009-11-12
Information query
