Invention Grant
- Patent Title: Workpiece displacement system
- Patent Title (中): 工件排量系统
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Application No.: US11465769Application Date: 2006-08-18
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Publication No.: US08632112B2Publication Date: 2014-01-21
- Inventor: Hyunjoo Kim , Hunki Lee , Changyong Lee , Jong Wook Ju , Sang-Ho Lee
- Applicant: Hyunjoo Kim , Hunki Lee , Changyong Lee , Jong Wook Ju , Sang-Ho Lee
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: B25J15/06
- IPC: B25J15/06

Abstract:
A method of operation of a workpiece displacement system includes: providing a head including a conduit, a recess port, and a channel, the conduit configured such that its major axis intersects the recess port and the channel; inserting a force distribution member into the recess port; and supplying a negative pressure state through the head and the force distribution member.
Public/Granted literature
- US20080066511A1 WORKPIECE DISPLACEMENT SYSTEM Public/Granted day:2008-03-20
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