Invention Grant
- Patent Title: LED module and method of bonding thereof
- Patent Title (中): LED模组及其结合方法
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Application No.: US13286562Application Date: 2011-11-01
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Publication No.: US08632221B2Publication Date: 2014-01-21
- Inventor: Wei-Yu Yeh
- Applicant: Wei-Yu Yeh
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: F21V29/00
- IPC: F21V29/00
Abstract:
The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).
Public/Granted literature
- US20130107549A1 LED MODULE AND METHOD OF BONDING THEREOF Public/Granted day:2013-05-02
Information query
