A connection arrangement with a plug element and a circuit board with plated-through holes. The plug element has a plurality of pluggable contact elements. The plated-through holes are arranged in an arrangement corresponding to the arrangement of the contact elements of the plug element. The plated-through holes and the contact elements that can be plugged into them, are matched to one another such that the plug element is manually connectable to the circuit board by inserting the contact elements into the plated-through holes and the plug element is manually removable. The contact elements are simultaneously pluggable into their associated plated-through holes. The contact elements include two legs having a space between them, with both legs of each contact element pluggable into a respective plated-through hole.