Invention Grant
- Patent Title: Socket with integrated damping resistor
- Patent Title (中): 带集成阻尼电阻的插座
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Application No.: US13435895Application Date: 2012-03-30
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Publication No.: US08632366B2Publication Date: 2014-01-21
- Inventor: Hideki Sano , Hiroyuki Abe , Yasushi Ishikawa , Toyokazu Ezura , Yasuhisa Tsukada
- Applicant: Hideki Sano , Hiroyuki Abe , Yasushi Ishikawa , Toyokazu Ezura , Yasuhisa Tsukada
- Applicant Address: US MA Attleboro
- Assignee: Sensata Technologies Massachusetts, Inc.
- Current Assignee: Sensata Technologies Massachusetts, Inc.
- Current Assignee Address: US MA Attleboro
- Agency: Chapin IP Law, LLC
- Priority: JP2011-078596 20110331
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
This invention provides a socket for a circuit board that adds function of electrical resistive element to a contact. A socket includes a socket body extending at a longitudinal direction; and a plurality of contacts disposed in two lines along the longitudinal direction of the socket body. When a memory module is connected to the socket body, terminals formed on opposite surfaces of the memory module are electrically and elastically connected by the contacts. The contact includes a contact portion which contacts the terminal, a bent portion for generating an elastic force, and a base portion. The contact is made of a conductive metal having elastic properties, and the contact used for carrying signal is provided with a resistor of an electrical resistive material that is different from the conductive metal. The resistor is connected in a current path between the base portion and the terminal of the memory module.
Public/Granted literature
- US20120252233A1 SOCKET Public/Granted day:2012-10-04
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