Invention Grant
- Patent Title: Solutions and methods for metal deposition
- Patent Title (中): 金属沉积的方法和方法
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Application No.: US12916427Application Date: 2010-10-29
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Publication No.: US08632628B2Publication Date: 2014-01-21
- Inventor: Artur Kolics
- Applicant: Artur Kolics
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Williams IPS
- Agent Larry Williams
- Main IPC: C23C18/31
- IPC: C23C18/31 ; C23C18/32 ; C23C18/34 ; C23C18/36 ; C23C18/38 ; C23C18/40 ; C23C18/42 ; C23C18/44
Abstract:
One aspect of the present invention is a deposition solution to deposit metals and metal alloys such as for fabrication of electronic devices. According to one embodiment, the deposition solution comprises metal ions and a pH adjustor. The pH adjustor comprises a functional group having a general formula (R1R2N)(R3R4N)C═N—R5 where: N is nitrogen; C is carbon; and R1, R2, R3, R4, and R5 are the same or different and represent hydrogen, alkyl group, aryl group, or alkylaryl group. Another aspect of the presented invention is a method of preparing deposition solutions. Still another aspect of the present invention is a method of fabricating electronic devices.
Public/Granted literature
- US20120104331A1 SOLUTIONS AND METHODS FOR METAL DEPOSITION Public/Granted day:2012-05-03
Information query
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