Invention Grant
- Patent Title: Hardener for epoxy resins
- Patent Title (中): 环氧树脂固化剂
-
Application No.: US13756844Application Date: 2013-02-01
-
Publication No.: US08632654B2Publication Date: 2014-01-21
- Inventor: Pablo Walter , Mustapha Benomar , Stefan Keriling , Timothy Walsh , Rainer Schoenfeld
- Applicant: Henkel AG & Co. KGaA , Henkel Corporation
- Applicant Address: DE Duesseldorf US CT Rocky Hill
- Assignee: Henkel AG & Co. KGAA,Henkel US IP LLC
- Current Assignee: Henkel AG & Co. KGAA,Henkel US IP LLC
- Current Assignee Address: DE Duesseldorf US CT Rocky Hill
- Agent Sun Hee Lehmann
- Main IPC: C07C323/43
- IPC: C07C323/43 ; C09J163/04
Abstract:
The present application is directed to use of a thioether compound, obtainable from a first educt that comprises at least two thiol groups and from a second educt that comprises at least one α,β-unsaturated amide group as well as at least one tertiary amine group, for the hardening of reactive resins.
Public/Granted literature
- US20130146223A1 HARDENER FOR EPOXY RESINS Public/Granted day:2013-06-13
Information query
