Invention Grant
US08632939B2 Polymer, chemically amplified positive resist composition and pattern forming process
有权
聚合物，化学放大阳性抗蚀剂组合物和图案形成过程
- Patent Title: Polymer, chemically amplified positive resist composition and pattern forming process
- Patent Title (中): 聚合物，化学放大阳性抗蚀剂组合物和图案形成过程
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Application No.: US13035066Application Date: 2011-02-25
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Publication No.: US08632939B2Publication Date: 2014-01-21
- Inventor: Keiichi Masunaga , Satoshi Watanabe , Jun Hatakeyama , Youichi Ohsawa , Daisuke Domon
- Applicant: Keiichi Masunaga , Satoshi Watanabe , Jun Hatakeyama , Youichi Ohsawa , Daisuke Domon
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-041480 20100226
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/30 ; C08F220/22 ; G03F7/039
Abstract:
A polymer comprising recurring units having a fluorinated carboxylic acid onium salt structure on a side chain is used to formulate a chemically amplified positive resist composition. When the composition is processed by lithography to form a positive pattern, the diffusion of acid in the resist film is uniform and slow, and the pattern is improved in LER.
Public/Granted literature
- US20110212391A1 POLYMER, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS Public/Granted day:2011-09-01
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