Invention Grant
US08632945B2 Radiation-sensitive resin composition, monomer, polymer, and production method of radiation-sensitive resin composition
有权
辐射敏感性树脂组合物，单体，聚合物和辐射敏感性树脂组合物的制备方法
- Patent Title: Radiation-sensitive resin composition, monomer, polymer, and production method of radiation-sensitive resin composition
- Patent Title (中): 辐射敏感性树脂组合物，单体，聚合物和辐射敏感性树脂组合物的制备方法
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Application No.: US13479268Application Date: 2012-05-24
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Publication No.: US08632945B2Publication Date: 2014-01-21
- Inventor: Ken Maruyama
- Applicant: Ken Maruyama
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2009-278985 20091208; JP2010-055039 20100311; JP2010-130463 20100607
- Main IPC: C07C309/04
- IPC: C07C309/04 ; C08F228/00 ; G03F7/004 ; G03F7/028
Abstract:
A radiation-sensitive resin composition includes a solvent and a polymer. The polymer includes a repeating unit represented by a formula (I), a repeating unit represented by a formula (II), or a both thereof. Each of R1 to R3 independently represents a hydroxyl group, or the like. At least one of R1 represents a group having two or more heteroatoms. l is an integer from 1 to 5. Each of m and n is independently an integer from 0 to 5. Each of R7 and R11 independently represents a hydrogen atom, or the like. Each of R8 to R10 independently represents a hydrogen atom, or the like. A represents —O—, or the like. D represents a substituted or unsubstituted methylene group, or the like.
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