Invention Grant
- Patent Title: Method for adjusting fin width in integrated circuitry
- Patent Title (中): 在集成电路中调整散热片宽度的方法
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Application No.: US12952376Application Date: 2010-11-23
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Publication No.: US08633076B2Publication Date: 2014-01-21
- Inventor: Chien-Hsun Wang , Chih-Sheng Chang , Yi-Tang Lin
- Applicant: Chien-Hsun Wang , Chih-Sheng Chang , Yi-Tang Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A method includes growing a plurality of parallel mandrels on a surface of a semiconductor substrate, each mandrel having at least two laterally opposite sidewalls and a predetermined width. The method further includes forming a first type of spacers on the sidewalls of the mandrels, wherein the first type of spacers between two adjacent mandrels are separated by a gap. The predetermined mandrel width is adjusted to close the gap between the adjacent first type of spacers to form a second type of spacers. The mandrels are removed to form a first type of fins from the first type of spacers, and to form a second type of fins from spacers between two adjacent mandrels. The second type of fins are wider than the first type of fins.
Public/Granted literature
- US20120126325A1 METHOD FOR ADJUSTING FIN WIDTH IN INTEGRATED CIRCUITRY Public/Granted day:2012-05-24
Information query
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