Invention Grant
- Patent Title: Polyacetal resin composition
- Patent Title (中): 聚缩醛树脂组合物
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Application No.: US12810235Application Date: 2008-11-05
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Publication No.: US08633264B2Publication Date: 2014-01-21
- Inventor: Hiroyuki Hase
- Applicant: Hiroyuki Hase
- Applicant Address: JP Tokyo
- Assignee: Polyplastics Co., Ltd.
- Current Assignee: Polyplastics Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2007-333942 20071226
- International Application: PCT/JP2008/003184 WO 20081105
- International Announcement: WO2009/081517 WO 20090702
- Main IPC: C08K5/00
- IPC: C08K5/00 ; C08K5/34

Abstract:
The present invention provides a polyacetal resin composition having a metallic appearance, suppressing the generation of volatile organic compound (VOC), in particular formaldehyde from the molded article thereof to an extremely low level and giving excellent weathering (light) resistance. Specifically, (A) 100 parts by weight of a polyacetal copolymer containing 1.0 mmol/kg or smaller of a hemiformal terminal group, 2.0 mmol/kg or smaller of a formyl terminal group, 0.5 wt % or smaller of an unstable terminal group, (B) 0.03 to 0.30 part by weight of a hindered phenol-based antioxidant, (C) 0.01 to 1 part by weight of a guanamine compound, (D) 0.2 to 1 part by weight of a hindered amine-based stabilizer, and (E) 0.1 to 1 part by weight of an ultraviolet absorber, and (F) 1 to 20 parts by weight of a metallic pigment are blended together.
Public/Granted literature
- US20100280156A1 POLYACETAL RESIN COMPOSITION Public/Granted day:2010-11-04
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