Invention Grant
- Patent Title: Attaching structure of banding band
- Patent Title (中): 捆绑带的结构
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Application No.: US13545020Application Date: 2012-07-10
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Publication No.: US08633388B2Publication Date: 2014-01-21
- Inventor: Yukihiro Kawamura , Hiroaki Kamo
- Applicant: Yukihiro Kawamura , Hiroaki Kamo
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Edwards Wildman Palmer LLP
- Priority: JP2011-153676 20110712
- Main IPC: H01B7/00
- IPC: H01B7/00

Abstract:
An attaching wall 82 is interposed between first and second walls 81a, 81b. A banding band 9 is inserted from a first gap 83a provided between the attaching wall 82 and the first wall 81a to a second gap 83b provided between the attaching wall 82 and the second wall 81b, there by the banding band 9 is attached to the attaching wall 82. A through-hole 8 is provided on the attaching wall 82. A first guide wall 85a inclined toward the attaching wall 82 as extended toward the second wall 81b is arranged at a position facing the through-hole 84. Further, a second guide wall 85b inclined toward the attaching wall 82 as extended toward the second wall 81b is arranged at a position facing the second gap 83b.
Public/Granted literature
- US20130017012A1 ATTACHING STRUCTURE OF BANDING BAND Public/Granted day:2013-01-17
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