Invention Grant
- Patent Title: Printed circuit board, manufacturing method thereof and radio-frequency device
- Patent Title (中): 印刷电路板及其制造方法及射频装置
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Application No.: US12789247Application Date: 2010-05-27
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Publication No.: US08633393B2Publication Date: 2014-01-21
- Inventor: Ruiquan Yang , Haiqiang Sheng , Hongcai Li
- Applicant: Ruiquan Yang , Haiqiang Sheng , Hongcai Li
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: CN200710032455 20071214
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.
Public/Granted literature
- US20100238635A1 Printed circuit board, manufacturing method thereof and radio-frequency device Public/Granted day:2010-09-23
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