Invention Grant
- Patent Title: Flexible printed circuit board
- Patent Title (中): 柔性印刷电路板
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Application No.: US12780960Application Date: 2010-05-17
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Publication No.: US08633394B2Publication Date: 2014-01-21
- Inventor: Ying-Tso Lai , Hsiao-Yun Su
- Applicant: Ying-Tso Lai , Hsiao-Yun Su
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99112302A 20100420
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A FPCB includes a signal layer, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. At least one high speed signal transmission line is formed on the signal layer. The ground layer has a copper-removed area corresponding to the transmission line. Two ground lines are symmetrically disposed at two opposite sides of the signal transmission line and substantially parallel to the signal transmission line, each ground line and the signal transmission line is spaced at a first predetermined distance. Each ground line and the signal transmission line are spaced at a first predetermined distance.
Public/Granted literature
- US20110253424A1 FLEXIBLE PRINTED CIRCUIT BOARD Public/Granted day:2011-10-20
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