Invention Grant
- Patent Title: Compound semiconductor device, method for producing the same, and power supply
- Patent Title (中): 复合半导体器件及其制造方法和电源
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Application No.: US13371823Application Date: 2012-02-13
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Publication No.: US08633466B2Publication Date: 2014-01-21
- Inventor: Naoya Okamoto
- Applicant: Naoya Okamoto
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2011-040507 20110225
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
A compound semiconductor device includes: a substrate; a first compound semiconductor layer formed over the substrate; a second compound semiconductor layer formed over the first compound semiconductor layer; and an upper electrode formed over the first compound semiconductor layer, wherein two-dimensional hole gas is generated in a region of the first compound semiconductor layer, the region being located at an interface between the first compound semiconductor layer and the second compound semiconductor layer, so as to have a hole concentration that decreases with increasing distance from the upper electrode.
Public/Granted literature
- US20120218796A1 COMPOUND SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING THE SAME, AND POWER SUPPLY Public/Granted day:2012-08-30
Information query
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