Invention Grant
US08633466B2 Compound semiconductor device, method for producing the same, and power supply 有权
复合半导体器件及其制造方法和电源

  • Patent Title: Compound semiconductor device, method for producing the same, and power supply
  • Patent Title (中): 复合半导体器件及其制造方法和电源
  • Application No.: US13371823
    Application Date: 2012-02-13
  • Publication No.: US08633466B2
    Publication Date: 2014-01-21
  • Inventor: Naoya Okamoto
  • Applicant: Naoya Okamoto
  • Applicant Address: JP Kawasaki
  • Assignee: Fujitsu Limited
  • Current Assignee: Fujitsu Limited
  • Current Assignee Address: JP Kawasaki
  • Agency: Kratz, Quintos & Hanson, LLP
  • Priority: JP2011-040507 20110225
  • Main IPC: H01L29/06
  • IPC: H01L29/06
Compound semiconductor device, method for producing the same, and power supply
Abstract:
A compound semiconductor device includes: a substrate; a first compound semiconductor layer formed over the substrate; a second compound semiconductor layer formed over the first compound semiconductor layer; and an upper electrode formed over the first compound semiconductor layer, wherein two-dimensional hole gas is generated in a region of the first compound semiconductor layer, the region being located at an interface between the first compound semiconductor layer and the second compound semiconductor layer, so as to have a hole concentration that decreases with increasing distance from the upper electrode.
Information query
Patent Agency Ranking
0/0