Invention Grant
US08633511B2 Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material
有权
制造半导体器件封装的方法，其具有单独地附接到岛并且被封装材料覆盖的芯片
- Patent Title: Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material
- Patent Title (中): 制造半导体器件封装的方法，其具有单独地附接到岛并且被封装材料覆盖的芯片
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Application No.: US13203447Application Date: 2010-02-25
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Publication No.: US08633511B2Publication Date: 2014-01-21
- Inventor: Masakazu Watanabe , Takashi Kuramochi , Masahiro Hatanai
- Applicant: Masakazu Watanabe , Takashi Kuramochi , Masahiro Hatanai
- Applicant Address: BM Hamilton
- Assignee: ON Semiconductor Trading, Ltd.
- Current Assignee: ON Semiconductor Trading, Ltd.
- Current Assignee Address: BM Hamilton
- Agency: Morison & Foerster LLP
- Priority: JP2009-045570 20090227
- International Application: PCT/JP2010/053489 WO 20100225
- International Announcement: WO2010/098501 WO 20100902
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L23/48 ; H01L27/11 ; H01L23/495
Abstract:
A semiconductor device provided with: an island and an island which are separated from each other; leads which approach the islands at one end; a control element which is attached to the island and is connected to a lead through a thin metal wire; and a switching element which is attached to the island and is connected to the lead through a metal wire. Further, the thin metal wire and the thin metal wire are arranged so as to the intersect.
Public/Granted literature
- US20110309408A1 SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SAME Public/Granted day:2011-12-22
Information query
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