Invention Grant
US08633519B2 Group III nitride semiconductor device, production method therefor, power converter 有权
III族氮化物半导体器件及其制作方法,功率转换器

  • Patent Title: Group III nitride semiconductor device, production method therefor, power converter
  • Patent Title (中): III族氮化物半导体器件及其制作方法,功率转换器
  • Application No.: US12923405
    Application Date: 2010-09-20
  • Publication No.: US08633519B2
    Publication Date: 2014-01-21
  • Inventor: Toru Oka
  • Applicant: Toru Oka
  • Applicant Address: JP Kiyosu-Shi, Aichi-Ken
  • Assignee: Toyoda Gosei Co., Ltd.
  • Current Assignee: Toyoda Gosei Co., Ltd.
  • Current Assignee Address: JP Kiyosu-Shi, Aichi-Ken
  • Agency: McGinn IP Law Group, PLLC
  • Priority: JP2009-219254 20090924
  • Main IPC: H01L29/66
  • IPC: H01L29/66
Group III nitride semiconductor device, production method therefor, power converter
Abstract:
Provided is an HEMT exhibiting a normally-off characteristic and low on-state resistance, which includes a first carrier transport layer; two separate second carrier transport layers formed of undoped GaN and provided on two separate regions of the first carrier transport layer; and carrier supply layers formed of AlGaN and respectively provided on the two separate second carrier transport layers. The second carrier transport layers and the carrier supply layers are respectively formed through crystal growth on the first carrier transport layer. The heterojunction interface between the second carrier transport layer and the carrier supply layer exhibits high flatness, and virtually no growth-associated impurities are incorporated in the vicinity of the heterojunction interface. Therefore, reduction in mobility of 2DEG is prevented, and on-state resistance is reduced.
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