Invention Grant
US08633539B2 Trench transistor and manufacturing method of the trench transistor
有权
沟槽晶体管和制造方法的沟槽晶体管
- Patent Title: Trench transistor and manufacturing method of the trench transistor
- Patent Title (中): 沟槽晶体管和制造方法的沟槽晶体管
-
Application No.: US13170091Application Date: 2011-06-27
-
Publication No.: US08633539B2Publication Date: 2014-01-21
- Inventor: Martin Poelzl , Franz Hirler
- Applicant: Martin Poelzl , Franz Hirler
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A semiconductor device includes a semiconductor body including a first surface and a second surface. The semiconductor device further includes a trench structure extending into the semiconductor body from the first surface. The trench structure includes a first gate electrode part and a first gate dielectric part in a first part of the trench structure, and a second gate electrode part and a second gate dielectric part in a second part of the trench structure. A width of the trench structure in the first part is equal to the width of the trench structure in the second part. The semiconductor device further includes a body region adjoining the first and second gate dielectric parts at a side wall of the trench structure. A distance d1 between a bottom edge of the first gate dielectric part and the first surface and a distance d2 between a bottom edge of the second gate dielectric part and the first surface satisfies 50 nm
Public/Granted literature
- US20120326229A1 Trench Transistor and Manufacturing Method of the Trench Transistor Public/Granted day:2012-12-27
Information query
IPC分类: