Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13554514Application Date: 2012-07-20
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Publication No.: US08633546B2Publication Date: 2014-01-21
- Inventor: Hongbae Park , Hagju Cho , Sunghun Hong , Sangjin Hyun , Hoonjoo Na , Hyung-seok Hong
- Applicant: Hongbae Park , Hagju Cho , Sunghun Hong , Sangjin Hyun , Hoonjoo Na , Hyung-seok Hong
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2008-0092245 20080919; KR10-2009-0041271 20090512
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
A semiconductor device and associated methods, the semiconductor device including a semiconductor substrate with a first well region, a first gate electrode disposed on the first well region, and a first N-type capping pattern, a first P-type capping pattern, and a first gate dielectric pattern disposed between the first well region and the first gate electrode.
Public/Granted literature
- US20120280329A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-11-08
Information query
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