Invention Grant
- Patent Title: Multi-chip package with improved signal transmission
- Patent Title (中): 具有改进信号传输的多芯片封装
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Application No.: US12983211Application Date: 2010-12-31
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Publication No.: US08633568B2Publication Date: 2014-01-21
- Inventor: Young Won Kim , Jun Ho Lee , Hyun Seok Kim , Boo Ho Jung , Sun Ki Cho , Yang Hee Kim
- Applicant: Young Won Kim , Jun Ho Lee , Hyun Seok Kim , Boo Ho Jung , Sun Ki Cho , Yang Hee Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2010-0017458 20100226
- Main IPC: H01L27/08
- IPC: H01L27/08
Abstract:
Provided is an MCP including a plurality chips stacked therein. Each of the chips includes a plurality of inductor pads configured to transmit power or signals, and at both sides of a reference inductor pad, a first and a second inductor pads are formed to generate magnetic fluxes in different directions from each other.
Public/Granted literature
- US20110210419A1 MULTI-CHIP PACKAGE WITH IMPROVED SIGNAL TRANSMISSION Public/Granted day:2011-09-01
Information query
IPC分类:
