Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
-
Application No.: US12403499Application Date: 2009-03-13
-
Publication No.: US08633581B2Publication Date: 2014-01-21
- Inventor: See Beng Keh , Paulus Stefan , Auburger Albert , Wietschorke Helmut
- Applicant: See Beng Keh , Paulus Stefan , Auburger Albert , Wietschorke Helmut
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
A semiconductor device includes a carrier, a chip attached to the carrier, and an encapsulation body disposed over the chip and the carrier. An exterior surface of the semiconductor device includes an exposed peripheral edge of at least two of the carrier, the chip, and the encapsulation body.
Public/Granted literature
- US20100230799A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-09-16
Information query
IPC分类:
