Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
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Application No.: US13332658Application Date: 2011-12-21
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Publication No.: US08633588B2Publication Date: 2014-01-21
- Inventor: Tzu-Hung Lin , Ching-Liou Huang , Thomas Matthew Gregorich
- Applicant: Tzu-Hung Lin , Ching-Liou Huang , Thomas Matthew Gregorich
- Applicant Address: TW Hsin-Chu
- Assignee: Mediatek Inc.
- Current Assignee: Mediatek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
The invention provides a semiconductor package. The semiconductor package includes a substrate. A first conductive trace is disposed on the substrate. A solder resistance layer is disposed on the substrate, having an extending portion covering a portion of the first conductive trace, wherein a width of the extending portion of the solder resistance layer is larger than that of the portion of the first conductive trace. A semiconductor die is disposed over the first conductive trace.
Public/Granted literature
- US20130161810A1 SEMICONDUCTOR PACKAGE Public/Granted day:2013-06-27
Information query
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