Invention Grant
- Patent Title: Semiconductor chip with underfill anchors
- Patent Title (中): 具有底部填充锚的半导体芯片
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Application No.: US13766193Application Date: 2013-02-13
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Publication No.: US08633599B2Publication Date: 2014-01-21
- Inventor: Roden Topacio , Neil McLellan
- Applicant: Roden Topacio , Neil McLellan
- Applicant Address: CA Markham US CA Sunnyvale
- Assignee: ATI Technologies ULC,Advanced Micro Devices, Inc.
- Current Assignee: ATI Technologies ULC,Advanced Micro Devices, Inc.
- Current Assignee Address: CA Markham US CA Sunnyvale
- Agent Timothy M. Honeycutt
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
Various semiconductor chips and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in an insulating layer applied to a side of a semiconductor chip. The first opening does not extend through to the side. A second opening is formed in the insulating layer that exposes a portion of the side.
Public/Granted literature
- US20130154122A1 SEMICONDUCTOR CHIP WITH UNDERFILL ANCHORS Public/Granted day:2013-06-20
Information query
IPC分类:
