Invention Grant
- Patent Title: Device and method for manufacturing a device
- Patent Title (中): 用于制造设备的装置和方法
-
Application No.: US12886851Application Date: 2010-09-21
-
Publication No.: US08633600B2Publication Date: 2014-01-21
- Inventor: Manfred Mengel , Joachim Mahler , Khalil Hosseini
- Applicant: Manfred Mengel , Joachim Mahler , Khalil Hosseini
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A device includes a semiconductor material having a first surface. A first material is applied to the first surface and a fiber material is embedded in the first material.
Public/Granted literature
- US20120068364A1 Device and Method for Manufacturing a Device Public/Granted day:2012-03-22
Information query
IPC分类:
