Invention Grant
US08633643B2 LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
有权
LED封装，具有相同的LED封装模块及其制造方法，以及具有其相同的头灯模块及其控制方法
- Patent Title: LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
- Patent Title (中): LED封装，具有相同的LED封装模块及其制造方法，以及具有其相同的头灯模块及其控制方法
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Application No.: US12956812Application Date: 2010-11-30
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Publication No.: US08633643B2Publication Date: 2014-01-21
- Inventor: Young Jin Lee , Hyung Kun Kim
- Applicant: Young Jin Lee , Hyung Kun Kim
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2009-0116550 20091130
- Main IPC: H01J1/62
- IPC: H01J1/62 ; F21V1/00 ; H01L21/00 ; H01L33/00
Abstract:
Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.
Public/Granted literature
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