Invention Grant
- Patent Title: Misalignment tolerant contactless RF coupling device
- Patent Title (中): 不对中的非接触RF耦合器件
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Application No.: US13174178Application Date: 2011-06-30
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Publication No.: US08633784B2Publication Date: 2014-01-21
- Inventor: Conrad Ihla , Robert Charles Becker , Glen Backes , Alan Cornett , Matthew S. Marcus
- Applicant: Conrad Ihla , Robert Charles Becker , Glen Backes , Alan Cornett , Matthew S. Marcus
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01P3/08
- IPC: H01P3/08

Abstract:
Some embodiments relate to a contactless RF coupling device that includes a first substrate and a second substrate. The RF coupling device may provide a broadband, low loss electrical connection without mechanical contact as would a conventional mechanical connector. The first substrate includes a first ground plane on one side and a first transmission line on an opposing side. The first transmission line includes an enlarged first coupling member at an end of the first transmission line. The second substrate includes a second ground plane on one side and a second transmission line on an opposing side. The second transmission line includes an enlarged second coupling member at an end of the second transmission line. The first ground plane may not extend under the first coupling member and the second ground plane may include an opening that is aligned with the second coupling member.
Public/Granted literature
- US20130002376A1 MISALIGNMENT TOLERANT CONTACTLESS RF COUPLING DEVICE Public/Granted day:2013-01-03
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