Invention Grant
- Patent Title: Coupled MEMS structure for motion amplification
- Patent Title (中): 耦合MEMS结构用于运动放大
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Application No.: US12442369Application Date: 2007-09-21
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Publication No.: US08633787B2Publication Date: 2014-01-21
- Inventor: Shahyaan Desai , Anil N. Netravali , Michael O. Thompson
- Applicant: Shahyaan Desai , Anil N. Netravali , Michael O. Thompson
- Applicant Address: US NY Ithaca
- Assignee: Cornell Research Foundation, Inc.
- Current Assignee: Cornell Research Foundation, Inc.
- Current Assignee Address: US NY Ithaca
- Agency: Schwegman, Lundberg & Woessner, P.A.
- International Application: PCT/US2007/020501 WO 20070921
- International Announcement: WO2008/039378 WO 20080403
- Main IPC: H03H9/24
- IPC: H03H9/24 ; H03H9/50 ; G01P15/08
Abstract:
A microelectromechanical structure (MEMS) device includes a secondary MEMS element displaceably coupled to a substrate. A primary MEMS element is displaceably coupled to the secondary MEMS element and has a resonant frequency substantially equal to the secondary MEMS element and has a much larger displacement than the secondary MEMS element.
Public/Granted literature
- US20100295414A1 COUPLED MEMS STRUCTURE FOR MOTION AMPLIFICATION Public/Granted day:2010-11-25
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