Invention Grant
- Patent Title: Method of fabricating electronic apparatus
- Patent Title (中): 制造电子设备的方法
-
Application No.: US12915017Application Date: 2010-10-29
-
Publication No.: US08633908B2Publication Date: 2014-01-21
- Inventor: Yi-Shan Chang , Juin-Ming Wu , Shih-Hsiung Lin , Ying-Cheng Chen , Sheng-Hung Wang , Wen-Hau Lee , Chang-Cheng Chen
- Applicant: Yi-Shan Chang , Juin-Ming Wu , Shih-Hsiung Lin , Ying-Cheng Chen , Sheng-Hung Wang , Wen-Hau Lee , Chang-Cheng Chen
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99125148A 20100729
- Main IPC: G06F3/041
- IPC: G06F3/041

Abstract:
A method of fabricating an electronic apparatus having an active region and a peripheral region surrounding the active region is described. A first main device and a second main device are provided. An optical clear liquid adhesive (OCLA) is applied between the first main device and the second main device and within the active region. A photo-mask having a transparent region and an opaque region is provided above the second main device, and the transparent region corresponds to the peripheral region. An OCLA diffusion process is performed such that the OCLA diffuses from the active region to the peripheral region. During the OCLA diffusion process, a first irradiating process with the photo-mask is performed, such that the OCLA diffusing to the peripheral region is partially cured. After removing the photo-mask, a second irradiating process is performed, such that the OCLA is completely cured.
Public/Granted literature
- US20120026102A1 ELECTRONIC APPARATUS AND METHOD OF FABRICATING THE SAME Public/Granted day:2012-02-02
Information query