Invention Grant
US08634166B2 Suspension substrate, suspension, head suspension, hard disk drive having a conductive connection section covered by a metallic support layer, method for manufacturing suspension substrate and method for testing continuity of suspension
有权
悬挂基板，悬架，头悬挂，具有由金属支撑层覆盖的导电连接部分的硬盘驱动器，用于制造悬置基板的方法和用于测试悬架连续性的方法
- Patent Title: Suspension substrate, suspension, head suspension, hard disk drive having a conductive connection section covered by a metallic support layer, method for manufacturing suspension substrate and method for testing continuity of suspension
- Patent Title (中): 悬挂基板，悬架，头悬挂，具有由金属支撑层覆盖的导电连接部分的硬盘驱动器，用于制造悬置基板的方法和用于测试悬架连续性的方法
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Application No.: US13179001Application Date: 2011-07-08
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Publication No.: US08634166B2Publication Date: 2014-01-21
- Inventor: Masao Ohnuki , Yoichi Miura
- Applicant: Masao Ohnuki , Yoichi Miura
- Applicant Address: JP Shinjuku-Ku
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Shinjuku-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2010-160933 20100715
- Main IPC: G11B5/55
- IPC: G11B5/55 ; H05K1/09
Abstract:
A suspension substrate according the present invention includes: an insulating layer; a metallic support layer provided on the actuator element's side of the insulating layer. A wiring layer is provided on the other side of the insulating layer. This wiring layer includes a plurality of wirings and a wiring connection section that can be electrically connected with the actuator element via a conductive adhesive. A conductive connection section extending through the insulating layer and configured to connecting the metallic support layer with the wiring connection section of the wiring layer is provided in the connection structure region.
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