Invention Grant
- Patent Title: Automatic hinge opening assembly for electronic device
- Patent Title (中): 电子设备自动铰链打开组件
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Application No.: US12976440Application Date: 2010-12-22
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Publication No.: US08634183B2Publication Date: 2014-01-21
- Inventor: Jered H. Wikander , Shawn S. Mceuen , Mark MacDonald , Robert W. Wolcott
- Applicant: Jered H. Wikander , Shawn S. Mceuen , Mark MacDonald , Robert W. Wolcott
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Caven & Aghevli LLC
- Main IPC: E05F1/08
- IPC: E05F1/08 ; H05K7/00 ; H02K7/00 ; E05D11/10

Abstract:
In one embodiment an electronic device comprises a housing having a first section comprising a display and a second section comprising a keyboard coupled to the first section by a hinge assembly and an automatic hinge opening assembly for the housing. The automat hinge opening assembly comprises a hinge pin assembly mountable to the first section of the housing of the electronic device a pin rotatable about an axis between a first position and a second position and a hinge plate coupled to the pin and connectable to a hinge which connects the first section of the housing to a second section of the housing, and at least one torsion member coupled to the pin to apply a torque to the pin, wherein the torsion member is to store potential energy when the first section of the housing and the second section of the housing are in a closed position. Other embodiments may be described.
Public/Granted literature
- US20120162864A1 AUTOMATIC HINGE OPENING ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2012-06-28
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