Invention Grant
- Patent Title: Case mounting structure, case, and case mounting method
- Patent Title (中): 外壳安装结构,外壳和外壳安装方式
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Application No.: US12935029Application Date: 2009-04-07
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Publication No.: US08634205B2Publication Date: 2014-01-21
- Inventor: Keiichirou Kumagai
- Applicant: Keiichirou Kumagai
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2008-100909 20080409
- International Application: PCT/JP2009/057421 WO 20090407
- International Announcement: WO2009/125864 WO 20091015
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K7/18

Abstract:
A case mounting structure, a case, and a case mounting method, do not use a screw to fix the cover and has strong mounting strength against shock which is generated when the case falls. The case mounting structure includes a cover which can be attached to a case, and a lock part which is arranged on the case and locks the cover, where the lock part is deformed so as to prevent a movement for releasing lock when the cover is attached to the case.
Public/Granted literature
- US20110017754A1 CASE MOUNTING STRUCTURE, CASE, AND CASE MOUNTING METHOD Public/Granted day:2011-01-27
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