Invention Grant
- Patent Title: Transient thermal modeling of multisource power devices
- Patent Title (中): 多源功率器件的瞬态热建模
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Application No.: US13095406Application Date: 2011-04-27
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Publication No.: US08635044B2Publication Date: 2014-01-21
- Inventor: Maxat Touzelbaev , Yizhang Yang , Gamal Refai-Ahmed
- Applicant: Maxat Touzelbaev , Yizhang Yang , Gamal Refai-Ahmed
- Applicant Address: US CA Sunnyvale CA Markham, Ontario
- Assignee: Advanced Micro Devices, Inc.,ATI Technologies ULC
- Current Assignee: Advanced Micro Devices, Inc.,ATI Technologies ULC
- Current Assignee Address: US CA Sunnyvale CA Markham, Ontario
- Agency: Volpe and Koenig, P.C.
- Main IPC: G01K13/00
- IPC: G01K13/00

Abstract:
Embodiments of systems and methods for improved measurement of transient thermal responses in electronic systems are described herein. Embodiments of the disclosure use the known thermal transfer function of an electronic system to generate an equivalent resistor-capacitor (RC) network having a dynamic response that is identical to a given power excitation as the actual electronic system would have to that power excitation. Using the analogy between thermal and electrical systems, a Foster RC network is constructed, comprising a plurality of RC stages in which resistors and capacitors are connected in parallel. Subsequently, the analog thermal RC network is converted into an infinite impulse response (IIR) digital filter, whose coefficients can be obtained the Z-transform of the analog thermal RC network. This IIR digital filter establishes the recursive relationship between temperature output at the current time step and measured power input at the previous time step. Using this IIR digital filter, temperature response subject to arbitrary time-dependent power can be calculated in very small amount of time compared with prior art methods.
Public/Granted literature
- US20120278029A1 Transient Thermal Modeling of Multisource Power Devices Public/Granted day:2012-11-01
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