Invention Grant
- Patent Title: System for depositing microwire
- Patent Title (中): 用于存放微线的系统
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Application No.: US12985247Application Date: 2011-01-05
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Publication No.: US08635767B2Publication Date: 2014-01-28
- Inventor: Jonathan V. Vance
- Applicant: Jonathan V. Vance
- Applicant Address: US IL Chicago
- Assignee: Thoe Boeing Company
- Current Assignee: Thoe Boeing Company
- Current Assignee Address: US IL Chicago
- Agent Felix L. Fischer
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace.
Public/Granted literature
- US20120168204A1 SYSTEM FOR DEPOSITING MICROWIRE Public/Granted day:2012-07-05
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